Autoclave Bonding

Teledyne Labtech has invested heavily in the processes and equipment to allow Labtech to offer large format PCB. Key to this process is the use of a large Autoclave, this vital piece of equipment allows Labtech to bond and shape large PCB. These structures can be up to 2 metre in length and 0.6 metre wide.

This capability is ideal for the manufacture of large format antenna, especially those used in phased array radar, SSR (Secondary Surveillance Radar) and Ku/Ka band patch antenna for use in satcom applications

The Autoclave also offer the opportunity to bond PCB to mechanical structures, these can be bonded with either conductive (silver epoxy films) or non-conductive bond films.