Multi-layer PCB

Teledyne Labtech has established considerable technical knowledge and manufacturing experience in the supply of complex microwave PTFE and Mixed Dielectric Multi-layer PCB. From simple multi-layer structures through to complex metal-cored PCB, Teledyne Labtech can offer the complete solution.

Teledyne Labtech has a policy of continuous investment and now boasts a capability that can meet the most demanding RF/Microwave requirements. Teledyne Labtech can offer blind and buried, plated through vias (THP), laser cut cavities, embedded resistors and connectors.

• Mixed Dielectric Multi-layer PCB
• Embedded resistors, connector pins, and capacitors
• Complex machined and laser cut structures
• Metal-cored PCB
• Blind and buried via hole technology