RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.
Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
Manufacturing Capability
MIC Assembly
In-house RF machining and box build
In-house microwave PCB manufacture
In-house painting and conformal coating facilities
