Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation.  We specialize in low-volume, high-mix assembly of highly complex CCAs.

• RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates
• Typical lot sizes from 3 to 300 pieces
• 4 high speed, flexible SMT lines
• Production processes for components from 0201 chips to large grid-array components and connectors
• 100% solder paste, automated optical, and x-ray inspection
• Forced air convection reflow with inert atmosphere option
• Special processes for RF assemblies (filters, shields, etc)
• BGA underfill, conformal coating, etc.
• Selective and wave solder pin-thru-hole processes
• CCA and component bonding processes