X-Ray Inspection

ADVANCED ELECTRONIC SOLUTIONS

Processes

Teledyne EMS has x-ray capability for the inspection of hidden solder joints and other parameters not easily visible through normal inspection methods.
Automated x-ray inspection is available for product running at significant volumes with complex hidden features. Digital tomosynthesis technology can aquire multiple images at different slice heights in one inspection cycle.
Manual 2D x-ray may be used for inspection, process qualification, and other applications. Spot size to less than 1 um provides the versatility for a variety of electronic assembly applications.
All x-ray inspections and images are recorded and maintained so that they can be recalled by assembly serial number and reference designator at a later time