Relays & Switches - Packaged-InP
Teledyne Relays' packaged SPDT Indium Phosphide Active RF Switches provide low insertion loss and high linearity, with bandwidths from DC up to 60GHz. These switches also maintain excellent signal integrity beyond 40Gbps, and have a very compact package size of 3mm x 3mm x 1mm. Teledyne's Active RF switches are ideal for test and measurement systems, microwave communication, and radar applications.
InP1012-60
| Non-terminated SPDT Indium Phosphide Active RF Switch
• 3mm x 3mm x 1mm package size • 100ns switching time
• Monolithic solid-state switch with no mechanical wear
• Flip-chip packaging provides shock & vibration resistance
• ENEPIG surface finish for solder bonding
• Low loss package with organic overmold
• Test board with K-connectors can be provided
DC-60GHz 40+ Gbps
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InP1012-40 |
Non-terminated SPDT Indium Phosphide Active RF Switch
• 3mm x 3mm x 1mm package size • 100ns switching time
• Monolithic solid-state switch with no mechanical wear
• Flip-chip packaging provides shock & vibration resistance
• ENEPIG surface finish for solder bonding
• Low loss package with organic overmold
• Test board with K-connectors can be provided
DC-40GHz 40Gbps
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Non-terminated SPDT Indium Phosphide Active RF Switch
• 3mm x 3mm x 1mm package size • 100ns switching time
• Monolithic solid-state switch with no mechanical wear
• Flip-chip packaging provides shock & vibration resistance
• ENEPIG surface finish for solder bonding
• Low loss package with organic overmold
• Test board with K-connectors can be provided
DC-30GHz
|
| Non-terminated SPDT Indium Phosphide Active RF Switch
• 3mm x 3mm x 1mm package size • 100ns switching time
• Monolithic solid-state switch with no mechanical wear
• Flip-chip packaging provides shock & vibration resistance
• ENEPIG surface finish for solder bonding
• Low loss package with organic overmold
• Test board with K-connectors can be provided
DC-20GHz
|
InP1012-14 |
Non-terminated SPDT Indium Phosphide Active RF Switch
• 3mm x 3mm x 1mm package size • 100ns switching time
• Monolithic solid-state switch with no mechanical wear
• Flip-chip packaging provides shock & vibration resistance
• ENEPIG surface finish for solder bonding
• Low loss package with organic overmold
• Test board with K-connectors can be provided
DC-14GHz
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