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Microelectronic Assembly

Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding.

This capability ensures that any RF/Microwave PCB and assembly meets with the most demanding communications and space applications.

• Die attach
• Gold wire & ribbon bonding
• SMT assembly
• Connector assembly